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(R)
HIN232A
Data Sheet March 13, 2006 FN4316.12
High Speed +5V Powered RS-232 Transmitters/Receivers
The HIN232A high-speed RS-232 transmitter/receiver interface circuit meets all ElA high-speed RS-232E and V.28 specifications, and is particularly suited for those applications where 12V is not available. They require a single +5V power supply and feature onboard charge pump voltage converters which generate +10V and -10V supplies from the 5V supply. The drivers feature true TTL/CMOS input compatibility, slew rate-limited output, and 300 power-off source impedance. The receivers can handle up to 30V input, and have a 3k to 7k input impedance. The receivers also feature hysteresis to greatly improve noise rejection.
Features
* Meets All RS-232E and V.28 Specifications * Requires Only 0.1F or Greater External Capacitors * High Data Rate. . . . . . . . . . . . . . . . . . . . . . . . . . 230kbit/s * Requires Only Single +5V Power Supply * Onboard Voltage Doubler/Inverter * Low Power Consumption (Typ) . . . . . . . . . . . . . . . . . 5mA * Multiple Drivers - 10V Output Swing for +5V lnput - 300 Power-Off Source Impedance - Output Current Limiting - TTL/CMOS Compatible * Multiple Receivers - 30V Input Voltage Range - 3k to 7k Input Impedance - 0.5V Hysteresis to Improve Noise Rejection * Pb-Free Plus Anneal Available (RoHS Compliant)
Ordering Information
PART NO. HIN232ACB HIN232ACB-T HIN232ACBZ (See Note) HIN232ACBZ-T (See Note) HIN232ACBN HIN232ACBN-T HIN232ACBNZ (See Note) PART MARKING 232ACB 232ACB 232ACBZ 232ACBZ TEMP. RANGE (oC) 0 to 70 0 to 70 0 to 70 0 to 70 PACKAGE 16 Ld SOIC 16 Ld SOIC Tape and Reel 16 Ld SOIC (Pb-free) 16 Ld SOIC Tape and Reel (Pb-free) PKG. DWG. # M16.3 M16.3
Applications
M16.3 M16.3
232ACBN 232ACBN 232ACBNZ
0 to 70 0 to 70 0 to 70 0 to 70
16 Ld SOIC (N) M16.15 16 Ld SOIC (N) M16.15 Tape and Reel 16 Ld SOIC (N) M16.15 (Pb-free) 16 Ld SOIC (N) M16.15 Tape and Reel (Pb-free) 16 Ld PDIP 16 Ld PDIP* (Pb-free) E16.3 E16.3
* Any System Requiring High-Speed RS-232 Communication Ports - Computer - Portable, Mainframe, Laptop - Peripheral - Printers and Terminals - Instrumentation, UPS - Modems
HIN232ACBNZ-T 232ACBNZ (See Note) HIN232ACP HIN232ACPZ (See Note) HIN232ACP 232ACPZ
0 to 70 0 to 70
*Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
Selection Table
PART POWER SUPPLY NUMBER VOLTAGE HIN232A +5V NUMBER OF RS-232 DRIVERS 2 NUMBER OF RS-232 RECEIVERS 2 NUMBER OF 0.1F EXTERNAL CAPACITORS 4 Capacitors LOW POWER SHUTDOWN/TTL THREESTATE No/No NUMBER OF RECEIVERS ACTIVE IN SHUTDOWN 0
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2003, 2004, 2006. All Rights Reserved All other trademarks mentioned are the property of their respective owners.
HIN232A Pinout
HIN232A (PDIP, SOIC) TOP VIEW
C1+ 1 V+ 2 C1- 3 C2+ 4 C2- 5 V6 16 VCC 15 GND 14 T1OUT 13 R1IN 12 R1OUT 11 T1IN 10 T2IN 9 R2OUT 0.1F + 5 0.1F 1 + 3 4 C1+ C1C2+ C2+5V
16
VCC +5V TO 10V VOLTAGE INVERTER V+ 2 + 0.1F
T2OUT 7 R2IN 8
+10V TO -10V VOLTAGE INVERTER
V- 6 + 0.1F
T1IN
11
+5V 400k
T1
14
T1OUT
T2IN
10 12
+5V 400k
T2 7 13 R1IN R1 5k T2OUT
R1OUT
R2OUT
9 R2 GND 15 5k
8
R2IN
Pin Descriptions
PIN VCC V+ VGND C1+ C1C2+ C2TIN TOUT RIN ROUT Power Supply Input 5V 10%. Internally generated positive supply (+10V nominal). Internally generated negative supply (-10V nominal). Ground Lead. Connect to 0V. External capacitor (+ terminal) is connected to this lead. External capacitor (- terminal) is connected to this lead. External capacitor (+ terminal) is connected to this lead. External capacitor (- terminal) is connected to this lead. Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400k pull-up resistor to VCC is connected to each lead. Transmitter Outputs. These are RS-232 levels (nominally 10V). Receiver Inputs. These inputs accept RS-232 input levels. An internal 5k pull-down resistor to GND is connected to each input. Receiver Outputs. These are TTL/CMOS levels. FUNCTION
2
HIN232A
Absolute Maximum Ratings
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) Thermal Information
Thermal Resistance (Typical, Note 1)
JA (oC/W)
16 Ld SOIC (N) Package . . . . . . . . . . . . . . . . . . . . . 105 16 Ld SOIC (W) Package. . . . . . . . . . . . . . . . . . . . . 110 16 Ld PDIP Package*. . . . . . . . . . . . . . . . . . . . . . . . 85 Maximum Junction Temperature (Plastic Package) . . . . . .150oC Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC (SOIC - Lead Tips Only) *Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
Operating Conditions
Temperature Range HIN232ACX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE: 1. JA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
PARAMETER SUPPLY CURRENTS Power Supply Current, ICC Input Logic Low, VlL Input Logic High, VlH
Test Conditions: VCC = +5V 10%, C1-C4 = 0.1F; TA = Operating Temperature Range TEST CONDITIONS No Load, TA = 25oC TIN TIN TIN = 0V IOUT = 3.2mA IOUT = -1mA MIN TYP MAX UNITS
-
5
10
mA
LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS 2.0 3.5 15 0.1 4.6 0.8 200 0.4 V V A V V
Transmitter Input Pullup Current, IP TTL/CMOS Receiver Output Voltage Low, VOL TTL/CMOS Receiver Output Voltage High, VOH RECEIVER INPUTS RS-232 Input Voltage Range, VIN Receiver Input Impedance, RIN Receiver Input Low Threshold, VIN (H-L) Receiver Input High Threshold, VIN (L-H) Receiver Input Hysteresis, VHYST TIMING CHARACTERISTICS Transmitter, Receiver Propagation Delay, tPD Transition Region Slew Rate, SRT TRANSMITTER OUTPUTS Output Voltage Swing, TOUT Output Resistance, TOUT RS-232 Output Short Circuit Current, ISC ESD PERFORMANCE RS-232 Pins (TOUT, RIN)
-30 VIN = 3V, TA = 25oC VCC = 5V, TA = 25oC VCC = 5V, TA = 25oC VCC = 5V 3.0 0.2
5.0 1.2 1.7 0.5
+30 7.0 2.4 1.0
V k V V V s V/s
RL = 3k, CL = 1000pF, Measured from +3V to -3V or -3V to +3V, (Note 2) 1 Transmitter Switching 3
0.5 20
10 45
Transmitter Outputs, 3k to Ground VCC = V+ = V- = 0V, VOUT = 2V TOUT Shorted to GND Human Body Model IEC1000-4-2 Contact Discharge IEC1000-4-2 Air Gap (Note 3)
5 300 -
9 10 15 8 15 2
10 -
V mA
-
-
kV kV kV kV
All Other Pins NOTES: 2. Guaranteed by design. 3. Meets level 4.
Human Body Model
3
HIN232A Test Circuits (HIN232A)
+4.5V TO +5.5V INPUT 0.1F C3 0.1F C1 +
+ 1 C1+ VCC 16 GND 15 T1OUT 14 R1IN 13 R1OUT 12 T1IN 11 T2IN 10 R2OUT 9 3k T1 OUTPUT RS-232 30V INPUT TTL/CMOS OUTPUT TTL/CMOS INPUT TTL/CMOS INPUT TTL/CMOS OUTPUT 2 V+ 3 C1-
1 C1+ 2 V+ 3 C14 C2+ 5 C26 V7 T2OUT 8 R2IN
VCC 16 GND 15 T1OUT 14 R1IN 13 R1OUT 12 T1IN 11 T2IN 10 R2OUT 9
-
0.1F + C2 0.1F C4 3k T2 OUTPUT RS-232 30V INPUT
4 C2+ 5 C2-
FIGURE 1. GENERAL TEST CIRCUIT
VCC + GND S3 RC OSCILLATOR C1C1 + S4 C3 VCC GND S7 C2S8 + C2 + C4
Detailed Description
The HIN232A is a high-speed RS-232 transmitter/receiver that is powered by a single +5V power supply, features low power consumption, and meets all ElA RS232C and V.28 specifications. The circuit is divided into three sections: the charge pump, transmitter, and receiver.
Charge Pump
An equivalent circuit of the charge pump is illustrated in Figure 3. The charge pump contains two sections: The voltage doubler and the voltage inverter. Each section is driven by a two phase, internally generated clock to generate +10V and -10V. The nominal clock frequency is 125kHz. During phase one of the clock, capacitor C1 is charged to VCC . During phase two, the voltage on C1 is added to VCC , producing a signal across C3 equal to twice VCC . During phase two, C2 is also charged to 2VCC , and then during phase one, it is inverted with respect to ground to produce a signal across C4 equal to -2VCC . The charge pump accepts input voltages up to 5.5V. The output impedance of the 4
-
+
6 V7 T2OUT 8 R2IN
ROUT = VIN /I
T2OUT T1OUT
VIN = 2V
A
FIGURE 2. POWER-OFF SOURCE RESISTANCE CONFIGURATION
VOLTAGE DOUBLER S1 C1+ S2 V+ = 2VCC S5
VOLTAGE INVERTER C2+ S6 GND
V- = - (V+)
FIGURE 3. CHARGE PUMP
voltage doubler section (V+) is approximately 200, and the output impedance of the voltage inverter section (V-) is approximately 450. A typical application uses 0.1F capacitors for C1-C4, however, the value is not critical. Increasing the values of C1 and C2 will lower the output impedance of the voltage doubler and inverter, increasing the values of the reservoir capacitors, C3 and C4, lowers the ripple on the V+ and V- supplies.
Transmitters
The transmitters are TTL/CMOS compatible inverters which translate the inputs to RS-232 outputs. The input logic threshold is about 26% of VCC, or 1.3V for VCC = 5V. A logic 1 at the input results in a voltage of between -5V and V- at the output, and a logic 0 results in a voltage between +5V and (V+ -0.6V). Each transmitter input has an internal 400k pullup resistor so any unused input can be left unconnected and its output remains in its low state. The output voltage swing meets the RS-232C specifications of 5V minimum with the worst case conditions of: all transmitters driving 3k minimum load
HIN232A
impedance, VCC = 4.5V, and maximum allowable operating temperature. The transmitters have an internally limited output slew rate which is less than 30V/s. The outputs are short circuit protected and can be shorted to ground indefinitely. The powered down output impedance is a minimum of 300 with 2V applied to the outputs and VCC = 0V.
TIN OR RIN TOUT OR ROUT VOH VOL tPHL tPLH tPHL + tPLH 2
Receivers
The receiver inputs accept up to 30V while presenting the required 3k to 7k input impedance even if the power is off (VCC = 0V). The receivers have a typical input threshold of 1.3V which is within the 3V limits, known as the transition region, of the RS-232 specifications. The receiver output is 0V to VCC. The output will be low whenever the input is greater than 2.4V and high whenever the input is floating or driven between +0.8V and -30V. The receivers feature 0.5V hysteresis (except during shutdown) to improve noise rejection.
V+ VCC 400k TXIN GND < TXIN < VCC V300 TOUT V- < VTOUT < V+
AVERAGE PROPAGATION DELAY =
FIGURE 6. PROPAGATION DELAY DEFINITION
Application Information
The HIN232A may be used for all RS-232 data terminal and communication links. It is particularly useful in applications where 12V power supplies are not available for conventional RS-232 interface circuits. The applications presented represent typical interface configurations. A simple duplex RS-232 port with CTS/RTS handshaking is illustrated in Figure 7. Fixed output signals such as DTR (data terminal ready) and DSRS (data signaling rate select) is generated by driving them through a 5k resistor connected to V+. In applications requiring four RS-232 inputs and outputs (Figure 8), note that each circuit requires two charge pump capacitors (C1 and C2) but can share common reservoir capacitors (C3 and C4). The benefit of sharing common reservoir capacitors is the elimination of two capacitors and the reduction of the charge pump source impedance which effectively increases the output swing of the transmitters.
FIGURE 4. TRANSMITTER
VCC RXIN -30V < RXIN < +30V GND 5k ROUT GND < VROUT < VCC
FIGURE 5. RECEIVER
+5V
+ 1 16 CTR (20) DATA TERMINAL READY DSRS (24) DATA SIGNALING RATE SELECT RS-232 INPUTS AND OUTPUTS TD (2) TRANSMIT DATA RTS (4) REQUEST TO SEND RD (3) RECEIVE DATA CTS (5) CLEAR TO SEND SIGNAL GROUND (7)
C1 + 0.1F C2 + 0.1F TD INPUTS OUTPUTS TTL/CMOS RTS RD CTS
3 HIN232A 4 5 11 10 12 9 R2 R1 T1 T2 14 7 13 8 6 +
15
FIGURE 7. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS HANDSHAKING
5
HIN232A
1 C1 + 0.1F TD INPUTS OUTPUTS TTL/CMOS RTS RD CTS 9 R2 R1 3 11 10 12 HIN232A T1 T2
4 5 14 7 13 8 15 16 VCC + C3 +5V RS-232 INPUTS AND OUTPUTS + C2 - 0.1F TD (2) TRANSMIT DATA RTS (4) REQUEST TO SEND RD (3) RECEIVE DATA CTS (5) CLEAR TO SEND
+
C4
6 6 V- V+
2
0.2F
2 16
0.2F VCC
HIN232A 1 C1 + 0.1F DTR INPUTS OUTPUTS TTL/CMOS DSRS DCD R1 9 R2 R1 8 3 11 10 12 T1 T2 4 5 14 7 13 + C2 - 0.1F DTR (20) DATA TERMINAL READY DSRS (24) DATA SIGNALING RATE SELECT DCD (8) DATA CARRIER DETECT R1 (22) RING INDICATOR SIGNAL GROUND (7)
15
FIGURE 8. COMBINING TWO HIN232As FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS
Typical Performance Curves
12 V- SUPPLY VOLTAGE (V) 0.1F SUPPLY VOLTAGE (V) 10 8 6 4 2 0 3.0
12 10 8 6 4 2 0 V- (VCC = 4V) TA = 25oC TRANSMITTER OUTPUTS OPEN CIRCUIT 0 5 10 15 20 25 V+ (VCC = 5V)
V+ (VCC = 4V)
V- (VCC = 5V) 30 35
3.5
4.0
4.5 VCC
5.0
5.5
6.0
|ILOAD| (mA)
FIGURE 9.
V- SUPPLY VOLTAGE vs VCC
FIGURE 10. V+, V- OUTPUT VOLTAGE vs LOAD
6
HIN232A Die Characteristics
DIE DIMENSIONS 160 mils x 140 mils METALLIZATION Type: Al Thickness: 10kA 1kA SUBSTRATE POTENTIAL V+ PASSIVATION Type: Nitride over Silox Nitride Thickness: 8kA Silox Thickness: 7kA TRANSISTOR COUNT 238 PROCESS CMOS Metal Gate
7
HIN232A Dual-In-Line Plastic Packages (PDIP)
N E1 INDEX AREA 12 3 N/2
E16.3 (JEDEC MS-001-BB ISSUE D)
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE INCHES SYMBOL
-B-
MILLIMETERS MIN 0.39 2.93 0.356 1.15 0.204 18.66 0.13 7.62 6.10 MAX 5.33 4.95 0.558 1.77 0.355 19.68 8.25 7.11 NOTES 4 4 8, 10 5 5 6 5 6 7 4 9 Rev. 0 12/93
MIN 0.015 0.115 0.014 0.045 0.008 0.735 0.005 0.300 0.240
MAX 0.210 0.195 0.022 0.070 0.014 0.775 0.325 0.280
A
E A2 L A C L
-AD BASE PLANE SEATING PLANE D1 B1 B 0.010 (0.25) M D1 A1
A1 A2
-C-
B B1 C D D1 E
eA eC
C
e
C A BS
eB
NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
E1 e eA eB L N
0.100 BSC 0.300 BSC 0.115 16 0.430 0.150
2.54 BSC 7.62 BSC 2.93 16 10.92 3.81
8
HIN232A Small Outline Plastic Packages (SOIC)
N INDEX AREA H E -B1 2 3 SEATING PLANE -AD -CA h x 45 0.25(0.010) M BM
M16.3 (JEDEC MS-013-AA ISSUE C)
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A
L
MILLIMETERS MIN 2.35 0.10 0.33 0.23 10.10 7.40 10.00 0.25 0.40 16 8 0 8 MAX 2.65 0.30 0.51 0.32 10.50 7.60 10.65 0.75 1.27 NOTES 9 3 4 5 6 7 Rev. 1 6/05
MIN 0.0926 0.0040 0.013 0.0091 0.3977 0.2914 0.394 0.010 0.016 16 0
MAX 0.1043 0.0118 0.0200 0.0125 0.4133 0.2992 0.419 0.029 0.050
A1 B C D E e H
C
A1 0.10(0.004)
0.050 BSC
1.27 BSC
e
B 0.25(0.010) M C AM BS
h L N
NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width "B", as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
9
HIN232A Small Outline Plastic Packages (SOIC)
N INDEX AREA H E -B1 2 3 SEATING PLANE -AD -CA h x 45o 0.25(0.010) M BM
M16.15 (JEDEC MS-012-AC ISSUE C) 16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
INCHES SYMBOL A A1 B MIN 0.053 0.004 0.014 0.007 0.386 0.150 MAX 0.069 0.010 0.019 0.010 0.394 0.157 MILLIMETERS MIN 1.35 0.10 0.35 0.19 9.80 3.80 MAX 1.75 0.25 0.49 0.25 10.00 4.00 NOTES 9 3 4 5 6 7 8o Rev. 1 02/02
L
C D E e H h
C
0.050 BSC 0.228 0.010 0.016 16 0o 8o 0.244 0.020 0.050
1.27 BSC 5.80 0.25 0.40 16 0o 6.20 0.50 1.27
e
B 0.25(0.010) M C AM BS

A1 0.10(0.004)
L N
NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width "B", as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
All Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation's quality certifications can be viewed at website www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com 10

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